Professional Experiences
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Graduate Research Assistant (GRA)

Holonyak Jr. Micro & Nanotechnology Laboratory

University of Illinois Urbana-Champaign (UIUC)

Research area: 2D Materials, Semiconductor Device

August 2024 – Present

Lecturer

Department of Electrical and Electronic Engineering (EEE)

Canadian University of Bangladesh (CUB)

Responsibility: Designed and delivered courses and co-supervised undergrad thesis.

On Leave from July 2024

Advisor & Coordinator

Club Electro

Canadian University of Bangladesh (CUB)

Responsibility: Advised research projects and organized departmental events.

On Leave from July 2024

Research Assistant

Nanoscale Simulation, Characterization & Fabrication Lab

Bangladesh University of Engineering and Technology (BUET)

Experience: I researched 2D transition metal dichalcogenides (TMDs), uncovering their novel nanophotonic, spintronic, and nanoelectronic properties for future semiconductor technologies at Nanoscale Simulation, Characterization & Fabrication Lab.

May 2022 – Jan 2023

Academic Instructor

UDVASH

Experience: During my undergrad, I spent 4 years teaching college-level math and physics to over 50 students at UDVASH.

Feb 2017 – Nov 2021

Leadership & Co-curricular Activities

Notre Dame Nature Study Club

Board Member

Sep 2015 – Feb 2016

IEEE EDS BUET SB Chapter

Secretary

Oct 2020 – Dec 2021

BUET Robotics Society

Executive Member

Jun 2019 – Oct 2019

Professional Research Supervision

1. Research Title: Impact of Temperature on Dielectric Properties of BiFeO3 Nanoparticles for PV Applications

Undergrad Thesis, Co-Supervision, Department of EEE, Canadian University of Bangladesh

○ In this work, the use of FESEM (Field Emission Scanning Electron Microscopy) and XRD (X-ray diffraction) methods were examined to photograph the microstructure and determine the molecular structure of crystalline materials.

Published work: https://doi.org/10.1109/GlobConET56651.2023.10150173

Professional Service & Outreach

Reviewer, 26th IEEE International Conference on Computer and Information Technology (ICCIT) 2023

○ I provided suggestions and recommendations for revisions, identified additional work needed or necessary for consideration, and/or made clarifications that would enhance the quality of the manuscript at the ICCIT 2023.

Reviewer, 5th IEEE International Conference on Telecommunications and Photonics (ICTP) 2023

○ I provided suggestions for revisions, identified additional work needed or necessary for consideration, and/or made clarifications that would enhance the quality of the manuscript at the ICTP 2023.

Technical Program Committee Member, 2nd IEEE International Conference on Information and Communication Technology for Sustainable Development (ICICT4SD) 2023

○ I oversaw the submission and review of papers, and organized the presentations delivered at the ICICT4SD 2023.

Peer Reviews

1. Computational Materials Science, Elsevier

2. Heliyon, Elsevier

3. Physica Scripta, IOPscience

Professional Membership

1. IEEE, Member

2. IEEE Electron Devices Society (IEEE EDS), Member

Standardized Test Score

IELTS: 7.5/9.0

Listening: 6.0
Reading: 9.0
Writing: 7.5
Speaking: 7.0